PIONEER OF DIGITAL TECHPDT specializes in the manufacture and sales of factory automation facilities such as Semiconductor manufacturing equipment and FPD manufacturing equipment
In case of PCS and semiconductors, there is continuous thinning and slimming, therefore methods such as BUMP and TSV (Through Silicon Via) are used to connect chips depending on advancement of lamination structure. The core technology of such methods is using copper plating. Currently, overseas multinational companies are dominating the market for copper solutions and additives under fine chemical field.
For the first time in Korea, we introduced BUMP & TSV plating solution that was under national development and succeeded in mass producing them and now we are working with semiconductor manufacturers on inputting the mass production line.